PRODUCT
E beam evaporator
SEE-5
SPECIFICATIONS
| Deposition materials | Metal : Ag, Al, Au, Cu, Sn, Ti, Pt, Ge, Ni, Au,.. Oxide : SiO2, TiO2, Al2O3, Ta2O5,… TCO : ITO,… |
|---|---|
| Substrate size | Max. 8 inch |
| Product yield | 5 wafers/run@4inch, 3 wafers/run@6inch |
| Lamp heater | Max. 200℃ |
| E-beam gun | 15ccx6pk , 25ccx4pk or 7cc*4pk |
| E-beam power supply | 6KW or 10KW |
| Pocket selector | 6 pocket indexer |
| Beam sweep controller | Digital sweep control |
| Thickness controller | Single Q’tz crystal sensor & controller |
| Ultimate pressure | < 5.0E-7 Torr (Cryo pump or TMP) |
| Control | PC control (UPRO software) |
| Option | Loadlock chamber, Ion source, substrate cooling- tilting & rotation |
| Dimension (W*D*H) | 1,010mm X 1,460mm X 1,790mm |