PRODUCT
ASHER
EURA-W
SPECIFICATIONS
| Process | Ashing, Descum, PR strip, Plasma cleaning,… |
|---|---|
| Substrate Size | Piece to Max. 12 inch |
| Source injection | Two pattern showerhead |
| Substrate temperature | Cooling or Max. 300℃ (@ wafer) |
| RF power | 2KW @13.56Mhz |
| Ultimate pressure | < 5.0×10-3 Torr |
| Pump | Dry pump or Rotary pump |
| Gas Supply | Ar, O2,..etc |
| Deposition uniformity | ≤ ±5 % |
| System control | PC control |
| Dimension (w*d*h) | 800mm*800mm*1,150mm |